Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim. V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology. IEEE Access, 7:87907-87915, 2019. [doi]
@article{NaqviPBL19,
title = {V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology},
author = {Aqeel Hussain Naqvi and Jeong-Heum Park and Chang-Wook Baek and Sungjoon Lim},
year = {2019},
doi = {10.1109/ACCESS.2019.2925073},
url = {https://doi.org/10.1109/ACCESS.2019.2925073},
researchr = {https://researchr.org/publication/NaqviPBL19},
cites = {0},
citedby = {0},
journal = {IEEE Access},
volume = {7},
pages = {87907-87915},
}