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Aqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim. V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology. IEEE Access, 7:87907-87915, 2019. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) TechnologyAqeel Hussain Naqvi, Jeong-Heum Park, Chang-Wook Baek, Sungjoon Lim. access, 8:9513-9519, 2020. [doi]
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