SOI, interconnect, package, and mainboard thermal characterization - researchr publication authors

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Joseph Nayfach-Battilana, Jose Renau. SOI, interconnect, package, and mainboard thermal characterization. In JÃ¶rg Henkel, Ali Keshavarzi, Naehyuck Chang, Tahir Ghani, editors, Proceedings of the 2009 International Symposium on Low Power Electronics and Design, 2009, San Fancisco, CA, USA, August 19-21, 2009. pages 327-330, ACM, 2009. [doi]

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