Joseph Nayfach-Battilana, Jose Renau. SOI, interconnect, package, and mainboard thermal characterization. In Jörg Henkel, Ali Keshavarzi, Naehyuck Chang, Tahir Ghani, editors, Proceedings of the 2009 International Symposium on Low Power Electronics and Design, 2009, San Fancisco, CA, USA, August 19-21, 2009. pages 327-330, ACM, 2009. [doi]
@inproceedings{Nayfach-BattilanaR09,
title = {SOI, interconnect, package, and mainboard thermal characterization},
author = {Joseph Nayfach-Battilana and Jose Renau},
year = {2009},
doi = {10.1145/1594233.1594314},
url = {http://doi.acm.org/10.1145/1594233.1594314},
researchr = {https://researchr.org/publication/Nayfach-BattilanaR09},
cites = {0},
citedby = {0},
pages = {327-330},
booktitle = {Proceedings of the 2009 International Symposium on Low Power Electronics and Design, 2009, San Fancisco, CA, USA, August 19-21, 2009},
editor = {Jörg Henkel and Ali Keshavarzi and Naehyuck Chang and Tahir Ghani},
publisher = {ACM},
isbn = {978-1-60558-684-7},
}