Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration

Kiichi Niitsu, Yasufumi Sugimori, Yoshinori Kohama, Kenichi Osada, Naohiko Irie, Hiroki Ishikuro, Tadahiro Kuroda. Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration. IEEE Trans. VLSI Syst., 19(10):1902-1907, 2011. [doi]

@article{NiitsuSKOIIK11,
  title = {Analysis and Techniques for Mitigating Interference From Power/Signal Lines and to SRAM Circuits in CMOS Inductive-Coupling Link for Low-Power 3-D System Integration},
  author = {Kiichi Niitsu and Yasufumi Sugimori and Yoshinori Kohama and Kenichi Osada and Naohiko Irie and Hiroki Ishikuro and Tadahiro Kuroda},
  year = {2011},
  doi = {10.1109/TVLSI.2010.2056711},
  url = {http://dx.doi.org/10.1109/TVLSI.2010.2056711},
  tags = {analysis},
  researchr = {https://researchr.org/publication/NiitsuSKOIIK11},
  cites = {0},
  citedby = {0},
  journal = {IEEE Trans. VLSI Syst.},
  volume = {19},
  number = {10},
  pages = {1902-1907},
}