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Optimization methods for post-bond die-internal/external testing in 3D stacked ICs

Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen. Optimization methods for post-bond die-internal/external testing in 3D stacked ICs. In Ron Press, Erik H. Volkerink, editors, 2011 IEEE International Test Conference, ITC 2010, Austin, TX, USA, November 2-4, 2010. pages 193-201, IEEE, 2010. [doi]

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Brandon Noia

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Krishnendu Chakrabarty

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Erik Jan Marinissen

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