Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen. Optimization methods for post-bond die-internal/external testing in 3D stacked ICs. In Ron Press, Erik H. Volkerink, editors, 2011 IEEE International Test Conference, ITC 2010, Austin, TX, USA, November 2-4, 2010. pages 193-201, IEEE, 2010. [doi]
@inproceedings{NoiaCM10,
title = {Optimization methods for post-bond die-internal/external testing in 3D stacked ICs},
author = {Brandon Noia and Krishnendu Chakrabarty and Erik Jan Marinissen},
year = {2010},
doi = {10.1109/TEST.2010.5699219},
url = {http://dx.doi.org/10.1109/TEST.2010.5699219},
researchr = {https://researchr.org/publication/NoiaCM10},
cites = {0},
citedby = {0},
pages = {193-201},
booktitle = {2011 IEEE International Test Conference, ITC 2010, Austin, TX, USA, November 2-4, 2010},
editor = {Ron Press and Erik H. Volkerink},
publisher = {IEEE},
isbn = {978-1-4244-7206-2},
}