The following publications are possibly variants of this publication:
- Optimization Methods for Post-Bond Testing of 3D Stacked ICsBrandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen. et, 28(1):103-120, 2012. [doi]
- Test-architecture optimization for TSV-based 3D stacked ICsBrandon Noia, Sandeep Kumar Goel, Krishnendu Chakrabarty, Erik Jan Marinissen, Jouke Verbree. ets 2010: 24-29 [doi]
- Reuse-Based Optimization for Prebond and Post-Bond Testing of 3-D-Stacked ICsMukesh Agrawal, Krishnendu Chakrabarty, Randy Widialaksono. tcad, 34(1):122-135, 2015. [doi]
- Impact of mid-bond testing in 3D stacked ICsMottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen, Sudipta Bhawmik. dft 2013: 178-183 [doi]
- Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICsBrandon Noia. PhD thesis, Duke University, Durham, NC, USA, 2014. [doi]