Fine grain thermal modeling and experimental validation of 3D-ICs - researchr publication authors

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Oprins, H., Adi Srinivasan, Cupak, M., Cherman, V., Torregiani, C., Stucchi, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectronics Journal, 42(4):572-578, April 2011. [doi]

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