Vladimir Pasca, Lorena Anghel, Claudia Rusu, Riccardo Locatelli, Massimo Coppola. Error resilience of intra-die and inter-die communication with 3D spidergon STNoC. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 275-278, IEEE, 2010. [doi]
@inproceedings{PascaARLC10,
title = {Error resilience of intra-die and inter-die communication with 3D spidergon STNoC},
author = {Vladimir Pasca and Lorena Anghel and Claudia Rusu and Riccardo Locatelli and Massimo Coppola},
year = {2010},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5457198},
researchr = {https://researchr.org/publication/PascaARLC10},
cites = {0},
citedby = {0},
pages = {275-278},
booktitle = {Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010},
publisher = {IEEE},
}