Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration - researchr publication related

researchr

You are not signed in
Sign in
Sign up

Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh. Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]

The following publications are possibly variants of this publication:

Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D ICC. Hemanth Kumar, Asisa Kumar Panigrahi, Om Krishan Singh, Shiv Govind Singh. 3dic 2016: 1-4 [doi]

TSV noise coupling in 3D IC using guard ringR. Ranga Reddy, Sugandh Tanna, Shiv Govind Singh, Om Krishna Singh. 3dic 2015: [doi]

runs on WebDSL