Heterogeneous Monolithic 3D ICs: EDA Solutions, and Power, Performance, Cost Tradeoffs

Sai Surya Kiran Pentapati, Sung Kyu Lim. Heterogeneous Monolithic 3D ICs: EDA Solutions, and Power, Performance, Cost Tradeoffs. In 58th ACM/IEEE Design Automation Conference, DAC 2021, San Francisco, CA, USA, December 5-9, 2021. pages 925-930, IEEE, 2021. [doi]

Abstract

Abstract is missing.