The following publications are possibly variants of this publication:
- Heterogeneous Monolithic 3-D IC Designs: Challenges, EDA Solutions, and Power, Performance, Cost TradeoffsSai Pentapati, Sung Kyu Lim. tvlsi, 32(3):413-421, March 2024. [doi]
- Logic Monolithic 3D ICs: PPA Benefits and EDA Tools NecessarySai Surya Kiran Pentapati, Da Eun Shim, Sung Kyu Lim. glvlsi 2019: 445-450 [doi]
- Design Automation and Test Solutions for Monolithic 3D ICsLingjun Zhu, Arjun Chaudhuri, Sanmitra Banerjee, Gauthaman Murali, Pruek Vanna-Iampikul, Krishnendu Chakrabarty, Sung Kyu Lim. jetc, 18(1), 2022. [doi]
- Power, Performance, and Area Benefit of Monolithic 3D ICs for On-Chip Deep Neural Networks Targeting Speech RecognitionKyungwook Chang, Deepak Kadetotad, Yu Cao 0001, Jae-sun Seo, Sung Kyu Lim. jetc, 14(4), 2018. [doi]
- Hetero-3D: Maximizing Performance and Power Delivery Benefits of Heterogeneous 3D ICsLingjun Zhu, Jiawei Hu, Gauthaman Murali, Sung Kyu Lim. islped 2024: 1-6 [doi]
- Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICsShreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim. jicce, 12(3):186-192, 2014. [doi]
- RTL-to-GDS Tool Flow and Design-for-Test Solutions for Monolithic 3D ICsHeechun Park, Kyungwook Chang, Bon Woong Ku, Jinwoo Kim, Edward Lee, Daehyun Kim, Arjun Chaudhuri, Sanmitra Banerjee, Saibal Mukhopadhyay, Krishnendu Chakrabarty, Sung Kyu Lim. dac 2019: 101 [doi]
- Frequency and time domain analysis of power delivery network for monolithic 3D ICsKyungwook Chang, Shidhartha Das, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim. islped 2017: 1-6 [doi]