Novel low temperature 3D wafer stacking technology for high density device integration - researchr publication related

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Ionut Radu, Gweltaz Gaudin, W. van den Daele, F. Letertre, C. Mazure, Léa Di Cioccio, T. Lacave, F. Mazen, P. Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu. Novel low temperature 3D wafer stacking technology for high density device integration. In Proceedings of the European Solid-State Device Research Conference, ESSDERC 2013, Bucharest, Romania, September 16-20, 2013. pages 151-154, IEEE, 2013. [doi]

The following publications are possibly variants of this publication:

Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignmentGweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon. 3dic 2010: 1-4 [doi]

Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integrationMariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio. icicdt 2013: 231-234 [doi]

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