A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module

Pushparajah Rajaguru, Hua Lu 0003, Chris Bailey. A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55(11):2371-2381, 2015. [doi]

@article{Rajaguru0B15a,
  title = {A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module},
  author = {Pushparajah Rajaguru and Hua Lu 0003 and Chris Bailey},
  year = {2015},
  doi = {10.1016/j.microrel.2015.07.047},
  url = {http://dx.doi.org/10.1016/j.microrel.2015.07.047},
  researchr = {https://researchr.org/publication/Rajaguru0B15a},
  cites = {0},
  citedby = {0},
  journal = {Microelectronics Reliability},
  volume = {55},
  number = {11},
  pages = {2371-2381},
}