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Pushparajah Rajaguru, Hua Lu 0003, Chris Bailey. A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. Microelectronics Reliability, 55(11):2371-2381, 2015. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspectivePushparajah Rajaguru, Hua Lu 0003, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise. mr, 68:77-85, 2017. [doi]
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