Impact of via geometry and line extension on via-electromigration in nano-interconnects - researchr publication authors

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A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes. Impact of via geometry and line extension on via-electromigration in nano-interconnects. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-4, IEEE, 2023. [doi]

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