A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes. Impact of via geometry and line extension on via-electromigration in nano-interconnects. In IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023. pages 1-4, IEEE, 2023. [doi]
@inproceedings{SalehZCWC23,
title = {Impact of via geometry and line extension on via-electromigration in nano-interconnects},
author = {A. S. Saleh and Houman Zahedmanesh and Hajdin Ceric and Ingrid De Wolf and Kris Croes},
year = {2023},
doi = {10.1109/IRPS48203.2023.10118027},
url = {https://doi.org/10.1109/IRPS48203.2023.10118027},
researchr = {https://researchr.org/publication/SalehZCWC23},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {IEEE International Reliability Physics Symposium, IRPS 2023, Monterey, CA, USA, March 26-30, 2023},
publisher = {IEEE},
isbn = {978-1-6654-5672-2},
}