Michael Scheuermann, S. Tian, Raphael Robertazzi, Matthew R. Wordeman, C. Bergeron, H. Jacobson, Phillip Restle, Joel Silberman, Christy Tyberg. Thermal analysis of multi-layer functional 3D logic stacks. In 2016 IEEE International 3D Systems Integration Conference, 3DIC 2016, San Francisco, CA, USA, November 8-11, 2016. pages 1-4, IEEE, 2016. [doi]
Abstract is missing.