Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts - researchr publication authors

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Caleb Serafy, Ankur Srivastava. Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts. In Cliff C. N. Sze, Azadeh Davoodi, editors, International Symposium on Physical Design, ISPD'14, Petaluma, CA, USA, March 30 - April 02, 2014. pages 55-62, ACM, 2014. [doi]

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