Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts - researchr publication related

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Caleb Serafy, Ankur Srivastava. Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts. In Cliff C. N. Sze, Azadeh Davoodi, editors, International Symposium on Physical Design, ISPD'14, Petaluma, CA, USA, March 30 - April 02, 2014. pages 55-62, ACM, 2014. [doi]

The following publications are possibly variants of this publication:

TSV Replacement and Shield Insertion for TSV-TSV Coupling Reduction in 3-D Global PlacementCaleb Serafy, Ankur Srivastava. tcad, 34(4):554-562, 2015. [doi]

A geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICsCaleb Serafy, Bing Shi, Ankur Srivastava. integration, 47(3):307-317, 2014. [doi]

Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICsCaleb Serafy, Bing Shi, Ankur Srivastava. glvlsi 2013: 275-280 [doi]

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