Caleb Serafy, Bing Shi, Ankur Srivastava. Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. In José Luis Ayala, Alex K. Jones, Patrick H. Madden, Ayse Kivilcim Coskun, editors, Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013. pages 275-280, ACM, 2013. [doi]
Abstract is missing.