Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Caleb Serafy, Bing Shi, Ankur Srivastava. Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. In José Luis Ayala, Alex K. Jones, Patrick H. Madden, Ayse Kivilcim Coskun, editors, Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013. pages 275-280, ACM, 2013. [doi]

This author has not been identified. Look up 'Caleb Serafy' in GoogleThis author has not been identified. Look up 'Bing Shi' in GoogleThis author has not been identified. Look up 'Ankur Srivastava' in Google

runs on WebDSL