Caleb Serafy, Bing Shi, Ankur Srivastava. Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs. In José Luis Ayala, Alex K. Jones, Patrick H. Madden, Ayse Kivilcim Coskun, editors, Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013. pages 275-280, ACM, 2013. [doi]
@inproceedings{SerafySS13,
title = {Geometric approach to chip-scale TSV shield placement for the reduction of TSV coupling in 3D-ICs},
author = {Caleb Serafy and Bing Shi and Ankur Srivastava},
year = {2013},
doi = {10.1145/2483028.2483109},
url = {http://doi.acm.org/10.1145/2483028.2483109},
researchr = {https://researchr.org/publication/SerafySS13},
cites = {0},
citedby = {0},
pages = {275-280},
booktitle = {Great Lakes Symposium on VLSI 2013 (part of ECRC), GLSVLSI'13, Paris, France, May 2-4, 2013},
editor = {José Luis Ayala and Alex K. Jones and Patrick H. Madden and Ayse Kivilcim Coskun},
publisher = {ACM},
isbn = {978-1-4503-2032-0},
}