Caleb Serafy, Ankur Srivastava. Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts. In Cliff C. N. Sze, Azadeh Davoodi, editors, International Symposium on Physical Design, ISPD'14, Petaluma, CA, USA, March 30 - April 02, 2014. pages 55-62, ACM, 2014. [doi]
@inproceedings{SerafyS14,
title = {Coupling-aware force driven placement of TSVs and shields in 3D-IC layouts},
author = {Caleb Serafy and Ankur Srivastava},
year = {2014},
doi = {10.1145/2560519.2560532},
url = {http://doi.acm.org/10.1145/2560519.2560532},
researchr = {https://researchr.org/publication/SerafyS14},
cites = {0},
citedby = {0},
pages = {55-62},
booktitle = {International Symposium on Physical Design, ISPD'14, Petaluma, CA, USA, March 30 - April 02, 2014},
editor = {Cliff C. N. Sze and Azadeh Davoodi},
publisher = {ACM},
isbn = {978-1-4503-2592-9},
}