Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs - researchr publication authors

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Bing Shi, Ankur Srivastava, Avram Bar-Cohen. Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2012, Amherst, MA, USA, August 19-21, 2012. pages 33-38, IEEE, 2012. [doi]

This author has not been identified. Look up 'Bing Shi' in GoogleThis author has not been identified. Look up 'Ankur Srivastava' in GoogleThis author has not been identified. Look up 'Avram Bar-Cohen' in Google

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