Bing Shi, Ankur Srivastava, Avram Bar-Cohen. Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs. In IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2012, Amherst, MA, USA, August 19-21, 2012. pages 33-38, IEEE, 2012. [doi]
@inproceedings{ShiSB12,
title = {Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs},
author = {Bing Shi and Ankur Srivastava and Avram Bar-Cohen},
year = {2012},
doi = {10.1109/ISVLSI.2012.29},
url = {http://dx.doi.org/10.1109/ISVLSI.2012.29},
researchr = {https://researchr.org/publication/ShiSB12},
cites = {0},
citedby = {0},
pages = {33-38},
booktitle = {IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2012, Amherst, MA, USA, August 19-21, 2012},
publisher = {IEEE},
isbn = {978-1-4673-2234-8},
}