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Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs

Yuriy Shiyanovskii, Christos A. Papachristou, Cheng-Wen Wu. Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 24-29, IEEE, 2013. [doi]

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Yuriy Shiyanovskii

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Christos A. Papachristou

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Cheng-Wen Wu

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