Yuriy Shiyanovskii, Christos A. Papachristou, Cheng-Wen Wu. Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 24-29, IEEE, 2013. [doi]
@inproceedings{ShiyanovskiiPW13,
title = {Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs},
author = {Yuriy Shiyanovskii and Christos A. Papachristou and Cheng-Wen Wu},
year = {2013},
doi = {10.1109/ISQED.2013.6523585},
url = {http://dx.doi.org/10.1109/ISQED.2013.6523585},
researchr = {https://researchr.org/publication/ShiyanovskiiPW13},
cites = {0},
citedby = {0},
pages = {24-29},
booktitle = {International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013},
publisher = {IEEE},
isbn = {978-1-4673-4951-2},
}