Yuriy Shiyanovskii, Christos A. Papachristou, Cheng-Wen Wu. Analytical modeling and numerical simulations of temperature field in TSV-based 3D ICs. In International Symposium on Quality Electronic Design, ISQED 2013, Santa Clara, CA, USA, March 4-6, 2013. pages 24-29, IEEE, 2013. [doi]
Abstract is missing.