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Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study

Etienne Sicard, Jianfei Wu, Jiancheng Li. Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study. In 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013. pages 10-14, IEEE, 2013. [doi]

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Etienne Sicard

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Jianfei Wu

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Jiancheng Li

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