Etienne Sicard, Jianfei Wu, Jiancheng Li. Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study. In 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013. pages 10-14, IEEE, 2013. [doi]
@inproceedings{SicardWL13,
title = {Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study},
author = {Etienne Sicard and Jianfei Wu and Jiancheng Li},
year = {2013},
doi = {10.1109/EMCCompo.2013.6735164},
url = {https://doi.org/10.1109/EMCCompo.2013.6735164},
researchr = {https://researchr.org/publication/SicardWL13},
cites = {0},
citedby = {0},
pages = {10-14},
booktitle = {9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013},
publisher = {IEEE},
}