Etienne Sicard, Jianfei Wu, Jiancheng Li. Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study. In 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013. pages 10-14, IEEE, 2013. [doi]
Abstract is missing.