Impact of Radial defect clustering on 3D stacked IC yield from wafer to wafer stacking

Eshan Singh. Impact of Radial defect clustering on 3D stacked IC yield from wafer to wafer stacking. In 2012 IEEE International Test Conference, ITC 2012, Anaheim, CA, USA, November 5-8, 2012. pages 1-7, IEEE Computer Society, 2012. [doi]

Authors

Eshan Singh

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