Eshan Singh. Impact of Radial defect clustering on 3D stacked IC yield from wafer to wafer stacking. In 2012 IEEE International Test Conference, ITC 2012, Anaheim, CA, USA, November 5-8, 2012. pages 1-7, IEEE Computer Society, 2012. [doi]
@inproceedings{Singh12-20, title = {Impact of Radial defect clustering on 3D stacked IC yield from wafer to wafer stacking}, author = {Eshan Singh}, year = {2012}, doi = {10.1109/TEST.2012.6401567}, url = {http://doi.ieeecomputersociety.org/10.1109/TEST.2012.6401567}, researchr = {https://researchr.org/publication/Singh12-20}, cites = {0}, citedby = {0}, pages = {1-7}, booktitle = {2012 IEEE International Test Conference, ITC 2012, Anaheim, CA, USA, November 5-8, 2012}, publisher = {IEEE Computer Society}, isbn = {978-1-4673-1594-4}, }