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Eshan Singh. Impact of Radial defect clustering on 3D stacked IC yield from wafer to wafer stacking. In 2012 IEEE International Test Conference, ITC 2012, Anaheim, CA, USA, November 5-8, 2012. pages 1-7, IEEE Computer Society, 2012. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Analytical Modeling of 3D Stacked IC Yield from Wafer to Wafer Stacking with Radial Defect ClusteringEshan Singh. vlsid 2014: 26-31 [doi] Modeling location based wafer die yield variation in estimating 3D stacked IC yield from wafer to wafer stackingEshan Singh. vts 2014: 1-6 [doi]
The following publications are possibly variants of this publication: