Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee. Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectronics Reliability, 52(1):180-189, 2012. [doi]

Authors

Jenn-Ming Song

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Yao-Ren Liu

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Yi-Shao Lai

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Ying-Ta Chiu

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Ning-Cheng Lee

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