Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee. Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectronics Reliability, 52(1):180-189, 2012. [doi]
@article{SongLLCL12,
title = {Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints},
author = {Jenn-Ming Song and Yao-Ren Liu and Yi-Shao Lai and Ying-Ta Chiu and Ning-Cheng Lee},
year = {2012},
doi = {10.1016/j.microrel.2011.09.003},
url = {http://dx.doi.org/10.1016/j.microrel.2011.09.003},
researchr = {https://researchr.org/publication/SongLLCL12},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {52},
number = {1},
pages = {180-189},
}