Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee. Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectronics Reliability, 52(1):180-189, 2012. [doi]

Abstract

Abstract is missing.