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Taigon Song, Chang Liu, Yarui Peng, Sung Kyu Lim. Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs. IEEE Trans. VLSI Syst., 24(5):1636-1648, 2016. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Signal integrity analysis and optimization for 3D ICsChang Liu, Taigon Song, Sung Kyu Lim. isqed 2011: 42-49 [doi] Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3-D ICsYoung-Joon Lee, Sung Kyu Lim. tcad, 30(11):1635-1648, 2011. [doi]
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