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Thermomechanical modeling of 3D electronic packages

Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker. Thermomechanical modeling of 3D electronic packages. IBM Journal of Research and Development, 52(6):623-634, 2008. [doi]

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Sri M. Sri-Jayantha

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Gerald McVicker

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Kerry Bernstein

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John U. Knickerbocker

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