John U. Knickerbocker - researchr alias

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Viewing Publication 1 - 15 from 15

2020

Back to Finger-Writing: Fingertip Writing Technology Based on Pressure SensingGaddi Blumrosen, Katsuyuki Sakuma, John Jeremy Rice, John U. Knickerbocker. access, 8:35455-35468, 2020. [doi]

2019

Turning the Finger into a Writing ToolKatsuyuki Sakuma, Gaddi Blumrosen, John J. Rice, Jeff Rogers, John U. Knickerbocker. embc 2019: 1239-1242 [doi]

2012

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier InterconnectsTimothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman. jssc, 47(4):884-896, 2012. [doi]

2011

Technologies for exascale systemsPaul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov. ibmrd, 55(5):14, 2011. [doi]

2008

3D chip stacking with C4 technologyBing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker. ibmrd, 52(6):599-609, 2008. [doi]

PrefaceJohn U. Knickerbocker. ibmrd, 52(6):539-540, 2008. [doi]

Three-dimensional silicon integrationJohn U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright. ibmrd, 52(6):553-569, 2008. [doi]

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnectionsKatsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker. ibmrd, 52(6):611-622, 2008. [doi]

Thermomechanical modeling of 3D electronic packagesSri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker. ibmrd, 52(6):623-634, 2008. [doi]

2006

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-ViasJohn U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte. jssc, 41(8):1718-1725, 2006. [doi]

2005

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technologyJohn U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes. cicc 2005: 659-662 [doi]

2002

1992

High-performance glass-ceramic/copper multilayer substrate with thin-film redistributionRao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond. ibmrd, 36(5):889-904, 1992.

1991

IBM System/390 air-cooled alumina thermal conduction moduleJohn U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk. ibmrd, 35(3):330-341, 1991.

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