John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes. Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. In Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, CICC 2005, DoubleTree Hotel, San Jose, California, USA, September 18-21, 2005. pages 659-662, IEEE, 2005. [doi]
Abstract is missing.