Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker. Thermomechanical modeling of 3D electronic packages. IBM Journal of Research and Development, 52(6):623-634, 2008. [doi]
@article{Sri-JayanthaMBK08,
title = {Thermomechanical modeling of 3D electronic packages},
author = {Sri M. Sri-Jayantha and Gerald McVicker and Kerry Bernstein and John U. Knickerbocker},
year = {2008},
doi = {10.1147/JRD.2008.5388568},
url = {http://dx.doi.org/10.1147/JRD.2008.5388568},
tags = {modeling},
researchr = {https://researchr.org/publication/Sri-JayanthaMBK08},
cites = {0},
citedby = {0},
journal = {IBM Journal of Research and Development},
volume = {52},
number = {6},
pages = {623-634},
}