Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost

Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. J. Electronic Testing, 28(1):15-25, 2012. [doi]

Authors

Mottaqiallah Taouil

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Said Hamdioui

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Kees Beenakker

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Erik Jan Marinissen

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