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Mottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. Test Impact on the Overall Die-to-Wafer 3D Stacked IC Cost. J. Electronic Testing, 28(1):15-25, 2012. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Stacking order impact on overall 3D die-to-wafer Stacked-IC costMottaqiallah Taouil, Said Hamdioui. ddecs 2011: 335-340 [doi] Test Cost Analysis for 3D Die-to-Wafer StackingMottaqiallah Taouil, Said Hamdioui, Kees Beenakker, Erik Jan Marinissen. ats 2010: 435-441 [doi] 3D/ 2.5D stacked IC cost modeling and test flow selectionSaid Hamdioui. dtis 2014: 1 [doi]
The following publications are possibly variants of this publication: