Chin-Chi Teng, Yi-Kan Cheng, Elyse Rosenbaum, Sung-Mo Kang. iTEM: a temperature-dependent electromigration reliability diagnosis tool. IEEE Trans. on CAD of Integrated Circuits and Systems, 16(8):882-893, 1997. [doi]
@article{TengCRK97,
title = {iTEM: a temperature-dependent electromigration reliability diagnosis tool},
author = {Chin-Chi Teng and Yi-Kan Cheng and Elyse Rosenbaum and Sung-Mo Kang},
year = {1997},
doi = {10.1109/43.644613},
url = {http://doi.ieeecomputersociety.org/10.1109/43.644613},
tags = {reliability},
researchr = {https://researchr.org/publication/TengCRK97},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {16},
number = {8},
pages = {882-893},
}