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Moisture diffusion in BCB resins used for MEMS packaging

A. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto. Moisture diffusion in BCB resins used for MEMS packaging. Microelectronics Reliability, 43(9-11):1939-1944, 2003. [doi]

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A. Tetelin

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C. Pellet

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J.-Y. Delétage

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B. Carbonne

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Y. Danto

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