A. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto. Moisture diffusion in BCB resins used for MEMS packaging. Microelectronics Reliability, 43(9-11):1939-1944, 2003. [doi]
@article{TetelinPDCD03,
title = {Moisture diffusion in BCB resins used for MEMS packaging},
author = {A. Tetelin and C. Pellet and J.-Y. Delétage and B. Carbonne and Y. Danto},
year = {2003},
doi = {10.1016/S0026-2714(03)00329-9},
url = {http://dx.doi.org/10.1016/S0026-2714(03)00329-9},
tags = {C++},
researchr = {https://researchr.org/publication/TetelinPDCD03},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {43},
number = {9-11},
pages = {1939-1944},
}