Y. Danto - researchr alias

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Viewing Publication 1 - 17 from 17

2006

Multi-level Modeling of Hot Carrier Injection for ReliabilityC. Bestory, F. Marc, H. Levi, Y. Danto. fdl 2006: 61-68 [doi]

Improved physical understanding of intermittent failure in continuous monitoring methodW. C. Maia Filho, M. Brizoux, H. Frémont, Y. Danto. mr, 46(9-11):1886-1891, 2006. [doi]

2005

Vibration lifetime modelling of PCB assemblies using steinberg modelA. Dehbi, Y. Ousten, Y. Danto, W. Wondrak. mr, 45(9-11):1658-1661, 2005. [doi]

Electroluminescence spectroscopy for reliability investigations of 1.55 mum bulk semiconductor optical amplifierS. Huyghe, L. Béchou, N. Zerounian, Y. Deshayes, F. Aniel, A. Denolle, D. Laffitte, J. L. Goudard, Y. Danto. mr, 45(9-11):1593-1599, 2005. [doi]

2003

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuitsG. Andriamonje, V. Pouget, Y. Ousten, D. Lewis, Y. Danto, J. M. Rampnoux, Y. Ezzahri, Stefan Dilhaire, Stéphane Grauby, Wilfrid Claeys. mr, 43(9-11):1803-1807, 2003. [doi]

A physical approach on SCOBIC investigation in VLSIT. Beauchêne, D. Lewis, Felix Beaudoin, V. Pouget, Philippe Perdu, Pascal Fouillat, Y. Danto. mr, 43(1):173-177, 2003. [doi]

Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviationsJ.-Y. Delétage, F. J.-M. Verdier, B. Plano, Y. Deshayes, L. Béchou, Y. Danto. mr, 43(7):1137-1144, 2003. [doi]

Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modulesY. Deshayes, L. Béchou, J.-Y. Delétage, F. Verdier, Y. Danto, D. Laffitte, J. L. Goudard. mr, 43(7):1125-1136, 2003. [doi]

Reliability simulation of electronic circuits with VHDL-AMSF. Marc, B. Mongellaz, Y. Danto. fdl 2003: 175-184 [doi]

Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulatorL. Mendizabal, Jean-Louis Verneuil, L. Béchou, Christelle Aupetit-Berthelemot, Y. Deshayes, F. Verdier, Jean-Michel Dumas, Y. Danto, D. Laffitte, J. L. Goudard. mr, 43(9-11):1743-1749, 2003. [doi]

Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case studyB. Mongellaz, F. Marc, Y. Danto. mr, 43(9-11):1513-1518, 2003. [doi]

Moisture diffusion in BCB resins used for MEMS packagingA. Tetelin, C. Pellet, J.-Y. Delétage, B. Carbonne, Y. Danto. mr, 43(9-11):1939-1944, 2003. [doi]

2002

Acoustic analysis of an assembly: Structural identification by signal processing (wavelets)J. Augereau, Y. Ousten, L. Béchou, Y. Danto. mr, 42(9-11):1517-1522, 2002. [doi]

High temperature reliability testing of aluminum and tantalum electrolytic capacitorsA. Dehbi, W. Wondrak, Y. Ousten, Y. Danto. mr, 42(6):835-840, 2002. [doi]

Evaluation of a micropackaging analysis technique by highfrequency microwavesG. Duchamp, Y. Ousten, Y. Danto. mr, 42(9-11):1551-1554, 2002. [doi]

Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling languageB. Mongellaz, F. Marc, N. Milet-Lewis, Y. Danto. mr, 42(9-11):1353-1358, 2002. [doi]

Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditionsB. Trégon, Y. Ousten, Y. Danto, L. Béchou, B. Parmentier. mr, 42(7):1113-1120, 2002. [doi]

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